Co-packaged optics is a cutting-edge technology reshaping data transfer by integrating optical components directly onto chips. This innovation dramatically increases data speed and reduces power consumption, addressing the growing demands of modern computing. By minimizing the distance between optical and electronic components, co-packaged optics reduces latency and improves overall efficiency. It is especially crucial for high-performance computing, data centers, and cloud services. As the need for faster, more efficient data processing grows, co-packaged optics is set to play a pivotal role in revolutionizing the future of digital communication.
SANTA PAULA, Calif. — Abrisa Technologies, a provider of custom glass optics and thin film coatings and a subsidiary of HEF Photonics, has acquired Agama Glass Technologies, a manufacturer of etched anti-glare glass and technical glass processing. The acquisition, Abrisa said, expands its manufacturing footprint and adds a vertically integrated solution for chemically etched anti-glare display glass. According to Abrisa, Clarksburg, West Virginia-based Agama operates North America’s only high-volume technical glass etching facility. Agama's flagship product, AgamaEtch, is used in high-performance display and optics applications. The company's 85,000 sq ft facility also offers precision glass fabrication, chemical strengthening, and silk-screen printing, serving markets such as avionics, defense, medical, industrial, and touchscreen displays. Combined with Abrisa Technologies’ and HEF Photonics’ thin-film coating and surface engineering capabilities, Agama's offerings wi...
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